Lanshun PCB process capability
| ltem | Parameter | Remark |
|---|---|---|
| Minimum width / Minimum distance（mil） | 3/3 | Finished copper thickness：0.5OZ |
| Minimum ring width（mil） | Via Hole3mil Via Hole3mil |
|
| Minimum aperture | Board Thickness ＜ 2.0mm0.2mm Board Thickness ＜ 1.2mm0.1mm Board Thickness ≤ 2.0mmThickness diameter ratio |
Finished product aperture Finished product aperture Finished product aperture |
| Maximum plate thickness | Single and double layers8.0mm Multilayer board8.0mm |
|
| Minimum plate thickness | Single and double layers 4 layers0.2mm 6 layers0.4mm 8 layers0.6mm 10 layers1.0mm |
|
| Maximum size | Single and double layers600*1100mm Multilayer board600*1100mm |
|
| Max layers | 46 layers | |
| Resistance welding | Green window（mil） 2/4 Green oil Bridge（mil） 4 Color: white, black, blue, green, yellow, red, etc |
|
| Character | Minimum linewidth（mil） 5/8 Color: white, yellow, black, etc |
|
| Surface Coating | Tin spraying, electroless nickel / gold, chemical nickel / gold, tin precipitation, silver precipitation, oxidation resistance, pure tin spraying, etc | |
| Plate type | FR4、High frequency plate, polytetrafluoroethylene, aluminum base, copper base, thick copper foil, halogen-free material、Arlin、Rogers、 cem-1、cem-3 Mixed media pressing, flexible plate, soft and hard bonding plate |
Lanshun PCB production process
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- Step 1 -
Preliminary review of data
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- Step 2 -
Sales quotation
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- Step 3 -
Engineering data production
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- Step 4 -
Cutting and drilling
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- Step 5 -
Graphic transfer
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- Step 6 -
Electroplating and etching
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- Step 7 -
Solder resist, text
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- Step 8 -
Surface treatment process
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- Step 9 -
Forming
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- Step 10 -
Testing
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- Step 11 -
Shipment
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- Step 12 -
Service
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